View VNQ500PEP-E_9033859.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

september 2013 doc id 9934 rev 4 1/24 1 vnq500 quad channel high-side driver features cmos compatible i/o?s chip enable junction over temperature protection and diagnostic current limitation shorted load protection undervoltage shutdown protection against loss of ground very low standby current in compliance with the 2002/95/ec european directive description the vnq500 is a monolithic device designed in stmicroelectronics vipower m0-3 technology, intended for driving any kind of load with one side connected to ground. active current limitation, combined with latched thermal shutdown, protect the device against overload. in the case of over temperature of one channel the relative i/o pin is pulled down. the device automatically turns off in the case of ground pin disconnection. max supply voltage v cc 41v operating voltage range v cc 5.5 to 36v max on-state resistance r on 500m current limitation (typ) i lim 0.4a off-state supply current i s 25 a powersso-12 table 1. device summary package order codes tube tape and reel powersso-12 VNQ500PEP-E vnq500peptr-e www.st.com
contents vnq500 2/24 doc id 9934 rev 4 contents 1 block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.2 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.4 electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3 application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3.1 gnd protection network against reverse battery . . . . . . . . . . . . . . . . . . . 14 3.1.1 solution 1: a resistor in the ground line (rgnd only) . . . . . . . . . . . . . . 14 3.1.2 solution 2: a diode (d gnd ) in the ground line . . . . . . . . . . . . . . . . . . . . 15 3.2 load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.3 mcu i/o protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.4 maximum demagnetization energy (v cc = 13.5v) . . . . . . . . . . . . . . . . . . 16 4 package and thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.1 powersso-12 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 5 package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5.1 ecopack ? packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5.2 powersso-12 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5.3 powerss0-12 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 6 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
vnq500 list of tables doc id 9934 rev 4 3/24 list of tables table 1. device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 table 2. pin definitions and functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 table 3. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 table 4. thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 table 5. power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 6. switching (v cc =13v) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 7. input and ce pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 8. protections and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 9. truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 10. electrical transient requirements on vcc pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 table 11. thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 table 12. powersso-12 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 table 13. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
list of figures vnq500 4/24 doc id 9934 rev 4 list of figures figure 1. block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 2. configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 figure 3. current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 figure 4. switching time waveforms: turn-on and turn-off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 figure 5. driving circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 figure 6. waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 figure 7. off-state output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 8. high level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 9. input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 10. turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 11. overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 12. turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 13. ilim vs tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 14. on-state resistance vs vcc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 15. input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 16. input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 17. on-state resistance vs tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 18. input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 19. application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 20. maximum turn-off current versus load inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 21. powersso-12 pc board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 22. rthj-amb vs pcb copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 17 figure 23. thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 24. thermal fitting model of a quad channel hsd in powersso-12 . . . . . . . . . . . . . . . . . . . . 18 figure 25. powersso-12 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 figure 26. powersso-12 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 figure 27. powersso-12 tape and reel shipment (suffix ?tr?) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
vnq500 block diagram and pin description doc id 9934 rev 4 5/24 1 block diagram and pin description figure 1. block diagram table 2. pin definitions and functions pin no symbol function tab v cc positive power supply voltage 7,12 v cc positive power supply voltage 1 gnd logic ground 2 ce chip enable 3 i/o 1 input/output of channel 1 4 i/o 2 input/output of channel 2 5 i/o 3 input/output of channel 3 6 i/o 4 input/output of channel 4 8 output 4 high-side output of channel 4 9 output 3 high-side output of channel 3 10 output 2 high-side output of channel 2 11 output 1 high-side output of channel 1 v cc i/o 1 output 1 i/o 2 i/o 3 i/o 4 output 2 output 3 output 4 logic junction temp. detection undervoltage detection clamp power current limiter v cc clamp same structure for all channels gnd ce ot1 ot2 ot3 ot4
block diagram and pin description vnq500 6/24 doc id 9934 rev 4 figure 2. configuration diagram (top view) tab = v cc vcc output1 output3 output4 v cc output2 12 11 10 9 8 7 1 2 3 4 5 6 i/o4 gnd i/o1 i/o2 ce i/o3 powersso-12
vnq500 electrical specifications doc id 9934 rev 4 7/24 2 electrical specifications 2.1 absolute maximum ratings stressing the device above the rating listed in the ?absolute maximum ratings? table may cause permanent damage to the device. these are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. refer also to the stmicroelectronics sure program and other relevant quality document. 2.2 thermal data table 3. absolute maximum ratings symbol parameter value unit v cc dc supply voltage 41 v -v cc reverse supply voltage -0.3 v - i gnd dc ground pin reverse current - 250 ma i out dc output current internally limited a - i out reverse dc output current -1 a i in dc input current +/- 10 ma v esd electrostatic discharge (r = 1.5k ; c = 100pf) - i/on - outn and v cc 4000 5000 v v p tot power dissipation at t c = 25c 7.3 w t j junction operating temperature internally limited c t stg storage temperature - 55 to 150 c table 4. thermal data symbol parameter max. value unit r thj-case powersso-12 thermal resistance junction-case 17 c/w r thj-amb powersso-12 thermal resistance junction-ambient 61 (1) 1. when mounted on a standard single-sided fr-4 board with 0.5 cm 2 of cu (at least 35mm thick) connected to all v cc pins. 50 (2) 2. when mounted on a standard single-sided fr-4 board with 8 cm 2 of cu (at least 35mm thick) connected to all v cc pins. c/w
electrical specifications vnq500 8/24 doc id 9934 rev 4 2.3 electrical characteristics values specified in this section are for 8v vnq500 electrical specifications doc id 9934 rev 4 9/24 table 6. switching (v cc =13v) symbol parameter test conditions min. typ. max. unit t on turn-on time r l = 52 from 80% v out (1) 1. see figure 4: switching time waveforms: turn-on and turn-off . 50 s t off turn-off time r l = 52 to 10% v out (1) 75 s dv out /dt (on) turn-on voltage slope r l = 52 from v out = 1.3v to v out = 10.4v (1) 0.3 v/s dv out /dt (off) turn-off voltage slope r l = 52 from v out = 11.7v to v out = 1.3v (1) 0.3 v/s table 7. input and ce pin symbol parameter test conditions min. typ. max. unit v inl i/o low level 1.25 v i inl low level i/o current v in = 1.25v 1 a v inh i/o high level 3.25 v i inh high level i/o current v in = 3.25v 10 a v i(hyst) i/o hysteresis voltage 0.5 v v icl input clamp voltage i in = 1ma i in = - 1ma 6 6.8 - 0.7 8v v table 8. protections and diagnostics (1) 1. to ensure long term reliability under heavy overload or short circuit conditions , protection and related diagnostic signals must be used together with a proper so ftware strategy. if the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles. symbol parameter test conditions min. typ. max. unit v ol i/o low level default detection i in = 1ma, latched thermal shutdown 0.5 v t tsd junction shutdown temperature 150 175 200 c i lim dc short circuit current v cc = 13v; r load = 10m 0.4 0.6 0.9 a v demag turn-off output clamp voltage i out = 0.25 a; l = 50mh v cc - 41 v cc - 48 v cc - 55 v t reset thermal latch reset time t j < t tsd (see third figure in figure 6: waveforms ) 10 s
electrical specifications vnq500 10/24 doc id 9934 rev 4 figure 4. switching time waveforms: turn-on and turn-off figure 5. driving circuit 1. see figure 19: application schematic . table 9. truth table conditions mcoutn ce i/on output_n normal operation l h h h l h l h current limitation l h h h l h l h over temperature l h h h l l (latched) l l undervoltage l h h h l h l l standby x l x l t v out 90% 10% dv out /dt (off) dv out /dt (on) 80% t v in t on t off t r t f mcu mcoutn i/on vnq500pep rprot (1) outputn rprot (1) ce rprot (1) diagnostic feedback
vnq500 electrical specifications doc id 9934 rev 4 11/24 figure 6. waveforms table 10. electrical transient requirements on v cc pin iso t/r 7637/1 test pulse test level i ii iii iv delays and impedance 1 - 25v (1) 1. all functions of the device are performed as designed after exposure to disturbance. - 50v (1) - 75v (1) - 100v (1) 2ms, 10 2+ 25v (1) + 50v (1) + 75v (1) + 100v (1) 0.2ms, 10 3a - 25v (1) - 50v (1) - 100v (1) - 150v (1) 0.1s, 50 3b + 25v (1) + 50v (1) + 75v (1) + 100v (1) 0.1s, 50 4- 4v (1) - 5v (1) - 6v (1) - 7v (1) 100ms, 0.01 5 + 26.5v (1) + 46.5v (2) 2. one or more functions of the device is not perfo rmed as designed after exposure and cannot be returned to proper operation without replacing the device. + 66.5v (2) + 86.5v (2) 400ms, 2 mc outn 1) normal operation 2) undervoltage v cc v usd vusd hyst mc outn v outn vout n 3) shorted load operation i/o n i/ on mc outn i/o n t tsd t jn i outn ce ce ce t reset vol
electrical specifications vnq500 12/24 doc id 9934 rev 4 2.4 electrical characteristics curves figure 7. off-state output current figure 8. high level input current -50 -25 0 25 50 75 100 125 150 175 tc ( c) 0 0.03 0.06 0.09 0.12 0.15 0.18 0.21 0.24 0.27 0.3 il(off) (ua) vcc=36v -50 -25 0 25 50 75 100 125 150 175 tc ( c) 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 iih (ua) vin=3.25v figure 9. input clamp voltage figure 10. turn-off voltage slope -50 -25 0 25 50 75 100 125 150 175 tc ( c) 5 5.5 6 6.5 7 7.5 8 8.5 9 9.5 10 vicl (v) iin=1ma -50 -25 0 25 50 75 100 125 150 175 tc ( c) 0 100 200 300 400 500 600 700 800 900 1000 dvout/dt(on) (v/ms) vcc=13v rl=6.5ohm figure 11. overvoltage shutdown figure 12. turn-off voltage slope -50 -25 0 25 50 75 100 125 150 175 tc ( c ) 20 25 30 35 40 45 50 55 60 vov (v) -50 -25 0 25 50 75 100 125 150 175 tc ( c ) 400 450 500 550 600 650 700 750 800 dvout/dt(off) (v/ms) vcc=13v rl=6.5ohm
vnq500 electrical specifications doc id 9934 rev 4 13/24 figure 13. i lim vs t case figure 14. on-state resistance vs v cc -50 -25 0 25 50 75 100 125 150 175 tc ( c) 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 ilim (a) vcc=13v 5 10152025303540 vcc (v) 0 100 200 300 400 500 600 700 800 900 1000 ron (mohm) iout=0.25a tc= -40c tc = 25 c tc= 150c figure 15. input high level figure 16. input hysteresis voltage -50 -25 0 25 50 75 100 125 150 175 tc ( c) 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 vih (v) -50 -25 0 25 50 75 100 125 150 175 tc ( c) 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 vhyst (v) figure 17. on-state resistance vs tcase figure 18. input low level -50 -25 0 25 50 75 100 125 150 175 tc ( c ) 0 100 200 300 400 500 600 700 800 900 ron (mohm) iout=0.25a vcc=8v, 13v & 36v -50 -25 0 25 50 75 100 125 150 175 tc ( c) 1 1.25 1.5 1.75 2 2.25 2.5 2.75 3 vil (v)
application information vnq500 14/24 doc id 9934 rev 4 3 application information figure 19. application schematic 3.1 gnd protection network against reverse battery this section provides two solutions for implementing a ground protection network against reverse battery. 3.1.1 solution 1: a resistor in the ground line (r gnd only) this can be used with any type of load. the following show how to dimension the r gnd resistor: 1. r gnd 600mv / (i s(on)max ) 2. r gnd (? v cc ) / (-i gnd ) where -i gnd is the dc reverse ground pin current and can be found in the absolute maximum rating section of the device datasheet. power dissipation in r gnd (when v cc <0 during reverse battery situations) is: p d = (-v cc ) 2 /r gnd this resistor can be shared amongst several different hsds. please note that the value of this resistor should be calculated with formula (1) where i s(on)max becomes the sum of the maximum on-state currents of the different devices. please note that, if the microprocessor ground is not shared by the device ground, then the r gnd will produce a shift (i s(on)max * r gnd ) in the input thresholds and the status output values. this shift will vary depending on how many devices are on in the case of several high-side drivers sharing the same r gnd . v cc gnd output d gnd r gnd d ld mc +5v v gnd ce i/0n r prot r prot r prot diagnostic feedback
vnq500 application information doc id 9934 rev 4 15/24 if the calculated power dissipation requires the use of a large resistor, or several devices have to share the same resistor, then st suggests using solution 2 below. 3.1.2 solution 2: a diode (d gnd ) in the ground line note that a resistor (r gnd =1k ) should be inserted in parallel to d gnd if the device drives an inductive load. this small signal diode can be safely shared amongst several different hsds. also in this case, the presence of the ground network will produce a shift ( 600mv) in the input threshold and in the status output values if the microprocessor ground is not common to the device ground. this shift will not vary if more than one hsd shares the same diode/resistor network. 3.2 load dump protection d ld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the v cc maximum dc rating. the same applies if the device is subject to transients on the v cc line that are greater than those shown in the iso t/r 7637/1 table. 3.3 mcu i/o protection if a ground protection network is used and negative transients are present on the v cc line, the control pins will be pulled negative. st suggests to insert a resistor (r prot ) in line to prevent the c i/o pins from latching up. the value of these resistors is a compromise between the leakage current of c and the current required by the hsd i/os (input levels compatibility) with the latch-up limit of c i/os: -v ccpeak /i latchup r prot (v oh c -v ih -v gnd ) / i ihmax example for the following conditions: v ccpeak = - 100v i latchup 20ma v oh c 4.5v 5k r prot 180k . recommended values are: r prot =10k
application information vnq500 16/24 doc id 9934 rev 4 3.4 maximum demagnetization energy (v cc = 13.5v) figure 20. maximum turn-off current versus load inductance note: values are generated with r l =0 . in case of repetitive pulses, t jstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves b and c. 0,1 1 10 10 100 1000 l( mh) i lm ax (a) a b c a = single pulse at t jstart =150oc b= repetitive pulse at t jstart =100oc c= repetitive pulse at t jstart =125oc v in , i l t demagnetization demagnetization demagnetization
vnq500 package and thermal data doc id 9934 rev 4 17/24 4 package and thermal data 4.1 powersso-12 thermal data figure 21. powersso-12 pc board note: layout condition of r th and z th measurements (pcb fr4 area= 78mm x 78mm, pcb thickness=2mm,cu thickness=35 m, copper areas: from minimum pad lay-out to 16 cm 2 ). figure 22. r thj-amb vs pcb copper area in open box free air condition 45 50 55 60 65 70 75 0246810 rthj_amb(c/ w) pcb cu heatsink area (cm^ 2)
package and thermal data vnq500 18/24 doc id 9934 rev 4 figure 23. thermal impedance junction ambient single pulse equation 1: pulse calculation formula figure 24. thermal fitting model of a quad channel hsd in powersso-12 0,1 1 10 100 1000 0 0 0,01 0,1 1 10 100 1000 time (s) zth ( c/ w) footprint 8 cm 2 z th r th z thtp 1 ? () + ? = where t p t ? =
vnq500 package and thermal data doc id 9934 rev 4 19/24 table 11. thermal parameter area/island (cm 2 ) footprint 8 r1=r7=r9=r11 (c/w) 0.8 r2=r8=r10=r12 (c/w) 2.6 r3 (c/w) 1.5 r4 (c/w) 8 r5 (c/w) 28 18 r6 (c/w) 30 22 c1=c7=c9=c11 (w.s/c) 0.00006 c2=c8=c10=c12 (w.s/c) 0.0005 c3 (w.s/c) 0.015 c4 (w.s/c) 0.1 c5 (w.s/c) 0.15 0.17 c6 (w.s/c) 3 5
package and packing information vnq500 20/24 doc id 9934 rev 4 5 package and packing information 5.1 ecopack ? packages in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. 5.2 powersso-12 mechanical data table 12. powersso-12 mechanical data symbol millimeters min. typ. max. a 1.250 1.620 a1 0.000 0.100 a2 1.100 1.650 b 0.230 0.410 c 0.190 0.250 d 4.800 5.000 e 3.800 4.000 e0.800 h 5.800 6.200 h 0.250 0.500 l 0.400 1.270 k0o 8o x 1.900 2.500 y 3.600 4.200 ddd 0.100
vnq500 package and packing information doc id 9934 rev 4 21/24 figure 25. powersso-12 package dimensions
package and packing information vnq500 22/24 doc id 9934 rev 4 5.3 powerss0-12 packing information figure 26. powersso-12 tube shipment (no suffix) figure 27. powersso-12 tape and reel shipment (suffix ?tr?) base q.ty 100 bulk q.ty 2000 tube length ( 0.5) 532 a1.85 b6.75 c ( 0.1) 0.6 a c b base q.ty 2500 bulk q.ty 2500 a (max) 330 b (min) 1.5 c ( 0.2) 13 f20.2 g (+ 2 / -0) 12.4 n (min) 60 t (max) 18.4 reel dimensions tape dimensions according to electronic industries association (eia) standard 481 rev. a, feb. 1986 all dimensions are in mm. tape width w 12 tape hole spacing p0 ( 0.1) 4 component spacing p 8 hole diameter d ( 0.05) 1.5 hole diameter d1 (min) 1.5 hole position f ( 0.1) 5.5 compartment depth k (max) 4.5 hole spacing p1 ( 0.1) 2 top cover tape end start no components no components components 500mm min 500mm min empty components pockets saled with cover tape. user direction of feed
vnq500 revision history doc id 9934 rev 4 23/24 6 revision history table 13. document revision history date revision changes 24-jan-2006 1 initial release. 09-dec-2008 2 document restructured and reformatted. updated table 3: absolute maximum ratings - corrected p tot value. updated table 4: thermal data . updated figure 6: waveforms - corrected mc outn signal. updated table 10: electrical transient requirements on vcc pin . corrected figure 22: rthj-amb vs pcb copper area in open box free air condition . added ecopack ? packages information. 14-jul-2009 3 replaced the obsolete root part number VNQ500PEP-E with the new root part number vnq500. 20-sep-2013 4 updated disclaimer.
vnq500 24/24 doc id 9934 rev 4 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statem ents and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or register ed trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - swed en - switzerland - united kingdom - united states of america www.st.com

▲Up To Search▲

Price & Availability of VNQ500PEP-E

	To Download VNQ500PEP-E Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .